The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 02, 2025

Filed:

Nov. 26, 2021
Applicant:

Lg Innotek Co., Ltd., Seoul, KR;

Inventors:

Do Hyuk Yoo, Seoul, KR;

Seul Gi Lee, Seoul, KR;

Du Hyun Kim, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/00 (2006.01); H05K 3/38 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0242 (2013.01); H05K 3/0055 (2013.01); H05K 3/381 (2013.01); H05K 3/0035 (2013.01); H05K 3/425 (2013.01); H05K 2203/072 (2013.01); H05K 2203/0723 (2013.01);
Abstract

A circuit board according to an embodiment includes an insulating layer; and a via formed in the insulating layer; wherein a width of an upper surface of the via is greater than a width of a lower surface of the via, and wherein the width of the lower surface of the via is 75% to 95% of the width of the upper surface of the via.


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