The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 02, 2025

Filed:

Feb. 07, 2020
Applicant:

Sony Semiconductor Solutions Corporation, Kanagawa, JP;

Inventor:

Hirokazu Nakayama, Kanagawa, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/38 (2006.01); G01J 1/02 (2006.01); G01J 1/44 (2006.01); H10F 39/00 (2025.01); H10F 77/60 (2025.01);
U.S. Cl.
CPC ...
H01L 23/38 (2013.01); G01J 1/0271 (2013.01); G01J 1/44 (2013.01); H10F 39/011 (2025.01); H10F 39/804 (2025.01); H10F 77/60 (2025.01); G01J 2001/448 (2013.01);
Abstract

Provided is a sensor apparatus that can suppress movement of foreign matter from a Peltier element to a sensor element. The sensor apparatus includes a package substrate, a Peltier element, a circuit substrate, and a sensor element. The package substrate has a recess portion on a side of a first surface and plural terminals on a side of a second surface located on an opposite side of the first surface. The Peltier element is arranged in the recess portion. The circuit substrate is arranged on an opposite side of a bottom surface of the recess portion with the Peltier element sandwiched therebetween. The sensor element is attached to an opposite side of a surface, the surface being opposed to the Peltier element.


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