The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2025
Filed:
Apr. 17, 2023
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Abstract
A multilayer electronic component including a dielectric layer is provided. The dielectric layer includes a plurality of dielectric grains, and at least one of the plurality of dielectric grains has a core-interface shell-shell structure. The dielectric grain having the core-interface shell-shell structure includes a perovskite (BaTiO)-based base main component, a first subcomponent including silicon (Si), and a second subcomponent including at least one selected from the group consisting of manganese (Mn), vanadium (V), chromium (Cr), iron (Fe), nickel (Ni), cobalt (Co), copper (Cu), zinc (Zn), and tin (Sn). An average content of the first subcomponent is highest in the first interface shell region, and an average content of the second subcomponent is highest in the second interface shell region.