The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 02, 2025

Filed:

Nov. 01, 2022
Applicant:

Autodesk, Inc., San Francisco, CA (US);

Inventors:

Benjamin Mckittrick Weiss, Tualatin, OR (US);

Jesus Rodriguez, Farmington, MI (US);

Ebot Etchu Ndip-Agbor, Portland, OR (US);

Nigel Jed Wesley Morris, Toronto, CA;

Adrian Adam Thomas Butscher, Toronto, CA;

Assignee:

Autodesk, Inc., San Francisco, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B33Y 50/02 (2015.01); G05B 19/4099 (2006.01);
U.S. Cl.
CPC ...
G05B 19/4099 (2013.01); B33Y 50/02 (2014.12); G05B 2219/35134 (2013.01);
Abstract

Methods, systems, and apparatus, including medium-encoded computer program products, for computer aided design of physical structures using techniques that facilitate manufacturing, include: modifying a three dimensional shape, for which a corresponding physical structure is to be created using a manufacturing process, to produce a modified three dimensional shape; and providing the modified shape of the modeled object for use in manufacturing the physical structure using one or more computer-controlled manufacturing systems that employ the manufacturing process. The modifications can include, for each of two or more discrete layers of the three dimensional shape along a direction associated with the manufacturing process, extracting a two dimensional profile representation of the three dimensional shape in a current discrete layer, offsetting the two dimensional profile representation by an amount associated with the manufacturing process, and changing a next discrete layer using an offset two dimensional profile representation of the current discrete layer.


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