The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 02, 2025

Filed:

Feb. 03, 2022
Applicant:

Silicon Light Machines Corporation, San Jose, CA (US);

Inventors:

Alexander Payne, Ben Lommond, CA (US);

Gregory Jacob, Santa Clara, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/00 (2006.01); B81B 7/00 (2006.01); G02B 26/00 (2006.01); G02B 26/02 (2006.01); G02B 26/08 (2006.01);
U.S. Cl.
CPC ...
G03F 7/70291 (2013.01); B81B 7/0041 (2013.01); G02B 26/001 (2013.01); G02B 26/023 (2013.01); G02B 26/0808 (2013.01); G02B 26/0841 (2013.01); G03F 7/70191 (2013.01); B81B 2201/04 (2013.01);
Abstract

Microelectromechanical systems (MEMS) based spatial light modulators (SLMs) enclosed in a package filled with a gas to enhance the reliability and lifetime of the SLM, and methods for operating the same in various applications are described. Generally, the SLM includes a number of MEMS modulators, each including a number of light reflective surfaces, at least one light reflective surface coupled to an electrostatically deflectable element suspended above a substrate, and each adapted to reflect and modulate a light beam incident thereon. The package enclosing the SLM includes an optically transparent cover through which the reflective surfaces are exposed to the light beam, and a cavity is filled a low molar mass fill gas having an atomic number of two or less and a thermal conductivity of greater than 100 mW/(m·K). The SLM can include electrostatically deflectable ribbons suspended over a substrate, or a linear array of two-dimensional MEMS modulators.


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