The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 02, 2025

Filed:

Mar. 16, 2023
Applicant:

Hisense Broadband Multimedia Technologies Co., Ltd., Shandong, CN;

Inventors:

Honghao Zhang, Shandong, CN;

Jiaao Zhang, Shandong, CN;

Bin Wang, Shandong, CN;

Xujie Huang, Shandong, CN;

Shuhua Ye, Shandong, CN;

Xueru Liu, Shandong, CN;

Qinhao Fu, Shandong, CN;

Yifan Xie, Shandong, CN;

Yi Tang, Shandong, CN;

Benzheng Dong, Shandong, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 10/00 (2013.01); G02B 6/42 (2006.01);
U.S. Cl.
CPC ...
G02B 6/4246 (2013.01); G02B 6/4281 (2013.01); G02B 6/4292 (2013.01);
Abstract

An optical module includes a light receiving assembly and a first fiber optic adapter. The light receiving assembly includes a first lens group, a plurality of wavelength division demultiplexers and at least one light receiving component. The first lens group is configured to split optical signals transmitted to the first cavity body for a first time according to a wavelength to obtain a first optical signal beam and a second optical signal beam. The plurality of wavelength division demultiplexers include a first wavelength division demultiplexer and a second wavelength division demultiplexer. The first wavelength division demultiplexer is configured to split the first optical signal beam for a second time according to a wavelength. The second wavelength division demultiplexer is configured to split the second optical signal beam for a second time according to a wavelength. The light receiving component includes a plurality of light receiving chips.


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