The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 02, 2025

Filed:

Nov. 28, 2023
Applicant:

Lenovo (Singapore) Pte. Ltd., Singapore, SG;

Inventors:

Tatsuya Hosokai, Yokohama, JP;

Hidehisa Mori, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/16 (2006.01); B29C 65/48 (2006.01); F16M 13/00 (2006.01); H05K 5/00 (2025.01); H05K 7/00 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
F16M 13/00 (2013.01); B29C 65/486 (2013.01); B29L 2031/7502 (2013.01);
Abstract

A stand supports an electronic apparatus in an erect state. The stand includes: a supporting portion that has a supporting surface which supports a rear surface of the electronic apparatus; a leg portion that is rotatably connected to the supporting portion via a hinge; a flexible member that has flexibility, that is formed in a sheet shape, and that is provided along one edge of the supporting portion so as to protrude from the one edge; a surface material that has flexibility and forms front surfaces of the supporting portion and the flexible member; a first bonding layer that fixes the surface material onto the supporting portion; and a second bonding layer that is formed to have a lower coating density of a bonding adhesive than the first bonding layer and fixes the surface material onto the flexible member.


Find Patent Forward Citations

Loading…