The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2025
Filed:
Feb. 05, 2021
Heraeus Materials Singapore Pte. Ltd., Singapore, SG;
Heraeus Deutschland Gmbh & Co. KG, Hanau, DE;
Murali Sarangapani, Singapore, SG;
Yee Weon Lim, Singapore, SG;
Wai Khee See Tho, Singapore, SG;
Mariyappan Dhayalan, Singapore, SG;
Chee Chow Tan, Singapore, SG;
Juergen Scharf, Hanau, DE;
Sungsig Kang, Singapore, SG;
HERAEUS ELECTRONICS GMBH & CO. KG, Hanau, DE;
HERAEUS MATERIALS SINGAPORE PTE. LTD., Singapore, SG;
Abstract
A wire comprising a wire core with a surface, the wire core having a coating layer superimposed on its surface, wherein the wire core itself is a silver-based wire core, wherein the coating layer is a double-layer comprised of a 1 to 100 nm thick inner layer of nickel or palladium and an adjacent 1 to 250 nm thick outer layer of gold, characterized in that the wire exhibits a total carbon content of ≤40 wt.-ppm.