The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2025
Filed:
May. 25, 2020
Dai-ichi High Frequency Co., Ltd., Tokyo, JP;
DAI-ICHI HIGH FREQUENCY CO., LTD., Tokyo, JP;
Abstract
A method of fusing an alloy-based material with a coating layer using a thermal spray process. The method includes determining a predetermined energization frequency of a high-frequency power supply unit based on a diffused area thickness (T) and a non-diffused area thickness (T) of the alloy-based material, inductively heating the alloy-based material and the coating layer to reach a predetermined temperature at the predetermined energization frequency of the high-frequency power supply unit, selectively heating the alloy-based material at the predetermined energization frequency within a penetration depth range of a total thickness (D) of the alloy-based material to suppress an austenite transformation of at least a portion of the alloy-based material, and fusing the selectively heated alloy-based material with the coating layer by suppressing the austenite transformation of at least the portion of the alloy-based material.