The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 02, 2025

Filed:

Apr. 20, 2020
Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Takanori Ito, Annaka, JP;

Akihiro Endo, Annaka, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08L 83/04 (2006.01); C08K 3/08 (2006.01); C08K 3/22 (2006.01); C08K 3/28 (2006.01); C08K 5/14 (2006.01); C08K 5/541 (2006.01); C09J 7/38 (2018.01); C09J 183/00 (2006.01);
U.S. Cl.
CPC ...
C08L 83/04 (2013.01); C08K 3/08 (2013.01); C08K 3/22 (2013.01); C08K 3/28 (2013.01); C08K 5/14 (2013.01); C08K 5/541 (2013.01); C09J 7/38 (2018.01); C09J 183/00 (2013.01); C09J 2301/408 (2020.08); C09J 2479/086 (2013.01); C09J 2483/00 (2013.01);
Abstract

The purpose of the present invention is therefore to provide a thermally conductive composite tape which is in a form of sheet and, therefore, easy to handle, excellent in strength and electrical insulation, easily stick to an element or heat release-member, and shows strong adhesion to the heat-release member. The present invention provides a thermally conductive composite comprising a first thermally conductive adhesive layer, a reinforcing layer (A) layered on one surface of the first thermally conductive adhesive layer, and a second thermally conductive adhesive layer layered on a free surface of the reinforcing layer (A), wherein the first and second thermally conductive adhesive layers comprise, independently of each other, a silicone composition comprising the following components (a) to (e): 100 parts by mass of (a) linear or branched organopolysiloxane, 1,000 to 3,000 parts by mass of (b) thermally conductive filler, 100 to 500 parts by mass of (c) silicone resin, 1 to 10 parts by mass of (d) organohydrogenpolysiloxane, and 0.5 to 5 parts by mass of (e) organic peroxide.


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