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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12404386 B1

PDFFull Text
Date of Patent:
Sep. 02, 2025

Filed:

Aug. 08, 2023

Cured epoxy resin composition suitable for electronic device enclosure, articles, and methods

Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventors:

Brett A. Beiermann, St. Paul, MN (US);

John C. Clark, Maplewood, MN (US);

Eric G. Larson, Lake Elmo, MN (US);

Jeremy M. Higgins, Roseville, MN (US);

Audrey S. Forticaux, Minneapolis, MN (US);

Jay R. Lomeda, St. Paul, MN (US);

Wayne S. Mahoney, St. Paul, MN (US);

Scott B. Charles, Spring Valley, WI (US);

Timothy D. Fletcher, Lino Lakes, MN (US);

Wendy L. Thompson, Roseville, MN (US);

Kyle R. Schwartz, Maplewood, MN (US);

Assignee:

3M Innovative Properties Company, St. Paul, MN (US);

Attorney:

Carolyn A. Fischer

Primary Examiner:

Cheng Yuan Huang

Int. Cl.
CPC ...
C08K 3/22 (2006.01); C08K 3/14 (2006.01); C08K 3/38 (2006.01); C08K 7/20 (2006.01); C08L 63/00 (2006.01);
U.S. Cl.
CPC ...
C08K 3/22 (2013.01); C08K 3/14 (2013.01); C08K 3/38 (2013.01); C08K 7/20 (2013.01); C08L 63/00 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/385 (2013.01); C08K 2201/001 (2013.01); C08K 2201/009 (2013.01);
Abstract

An electronic device is described comprising an enclosure, wherein the enclosure comprises a cured epoxy resin composition comprising at least 50 volume % of electrically non-conductive thermally conductive inorganic particles. The enclosure may be a housing of a phone, laptop, or mouse. Alternatively, the enclosure may be a case for an electronic device. Also described are epoxy resin compositions and a method of making an enclosure for an electronic device.

Find Patent Forward Citations

Beiermann, Brett. (2025). Cured epoxy resin composition suitable for electronic device enclosure, articles, and methods (U.S. Patent No. 12404386). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12404386

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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