The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2025
Filed:
Jun. 03, 2021
Applicant:
Dic Corporation, Tokyo, JP;
Inventors:
Fuchih Li, Osaka, JP;
Kenji Nagao, Osaka, JP;
Assignee:
DIC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 5/04 (2006.01); D06M 15/27 (2006.01); D06M 15/273 (2006.01); D06M 15/55 (2006.01); D06M 15/564 (2006.01);
U.S. Cl.
CPC ...
C08J 5/042 (2013.01); D06M 15/27 (2013.01); D06M 15/273 (2013.01); D06M 15/55 (2013.01); D06M 15/564 (2013.01); C08J 2363/02 (2013.01);
Abstract
To provide a fiber bundling agent containing: a vinyl ester resin (A) having an alkoxy polyoxyalkylene structure, a urethane bond, a (meth)acryloyl group, and an epoxy group; and an aqueous medium, in which the vinyl ester resin (A) has an epoxy equivalent of 3,500 g/eq to 11,000 g/eq. Since the fiber bundling agent is excellent in bundling properties and in interfacial shear strength between fiber resins, the fiber bundling agent is suitably used for production of a fiber material capable of imparting excellent strength to a molded product.