The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 02, 2025

Filed:

Nov. 14, 2023
Applicant:

Northrop Grumman Systems Corporation, Falls Church, VA (US);

Inventors:

Talbot P. Thrasher, Newark, DE (US);

Timothy E. Dominick, Elkton, MD (US);

Assignee:

Northrop Grumman Systems Corporation, Falls Church, VA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C04B 35/83 (2006.01); B29C 64/118 (2017.01); B29C 64/30 (2017.01); B29K 71/00 (2006.01); B29K 81/00 (2006.01); B33Y 10/00 (2015.01); B33Y 40/00 (2020.01); B33Y 80/00 (2015.01); C04B 35/622 (2006.01); C04B 35/628 (2006.01); C04B 35/64 (2006.01);
U.S. Cl.
CPC ...
C04B 35/83 (2013.01); B29C 64/118 (2017.08); B29C 64/30 (2017.08); B33Y 10/00 (2014.12); B33Y 40/00 (2014.12); B33Y 80/00 (2014.12); C04B 35/6224 (2013.01); C04B 35/62272 (2013.01); C04B 35/62844 (2013.01); C04B 35/62886 (2013.01); C04B 35/64 (2013.01); B29K 2071/00 (2013.01); B29K 2081/04 (2013.01); C04B 2235/422 (2013.01); C04B 2235/5232 (2013.01); C04B 2235/5248 (2013.01); C04B 2235/5252 (2013.01); C04B 2235/6026 (2013.01); C04B 2235/616 (2013.01); C04B 2235/656 (2013.01);
Abstract

Methods for fabricating high-temperature composite structures (e.g., structures comprising carbon-carbon composite materials or ceramic composite matrix (CMC) materials and configured for use at temperature at or exceeding about 2000° F. (1093° C.)) include forming precursor structures by additive manufacturing ('AM') (e.g., “3D printing”) with a filament drawn from a spool. The precursor structures are exposed to high temperatures to pyrolyze a precursor matric material of the initial 3D printed structure. A liquid resin is used to impregnate the pyrolyzed structure, to densify the structure into a near-net final shape. Use of expensive and time-consuming molds and post-processing machining may be avoided. Large, unitary, integrally formed parts conducive for use in high-temperature environments may be formed using the methods of the disclosure.


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