The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 02, 2025

Filed:

Jan. 30, 2023
Applicant:

Huawei Technologies Co., Ltd., Guangdong, CN;

Inventors:

Qin Shi, Nanjing, CN;

Qifang Hu, Shenzhen, CN;

Anping Qiu, Nanjing, CN;

Jinghui Xu, Shenzhen, CN;

Assignee:
Primary Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0048 (2013.01); B81C 1/00888 (2013.01); B81B 2201/0235 (2013.01); B81B 2201/0242 (2013.01);
Abstract

An MEMS device includes a package, a bottom plate, and a first inertial component. The first inertial component is located in packaging space formed by the bottom plate and the package. There is a first alignment part on a surface that is of the bottom plate and that faces the packaging space, and the first inertial component has a first mounting part. A shape of the first mounting part matches a shape of the first alignment part. The MEMS device is equipped with a mounting alignment reference, the first mounting part is connected to the first alignment part, and the first inertial component is mounted on the bottom plate at a preset angle. In addition, a bottom part of the first inertial component is not directly connected to the bottom plate.


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Shi, Qin. (2025). Mems device (U.S. Patent No. 12404168). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12404168

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