The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 02, 2025

Filed:

Dec. 22, 2021
Applicant:

Sony Group Corporation, Tokyo, JP;

Inventors:

Maho Watanabe, Tokyo, JP;

Hirohisa Amago, Tokyo, JP;

Yuriko Kaino, Tokyo, JP;

Kenji Takagi, Tokyo, JP;

Ryota Yamano, Tokyo, JP;

Hiroshi Mizuno, Tokyo, JP;

Aya Tejima, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41M 5/42 (2006.01); B41M 5/323 (2006.01); B41M 5/41 (2006.01); B41M 5/44 (2006.01); B41M 5/46 (2006.01); B42D 25/41 (2014.01); B41M 5/327 (2006.01); B41M 5/333 (2006.01); B41M 5/34 (2006.01); B42D 25/23 (2014.01);
U.S. Cl.
CPC ...
B41M 5/42 (2013.01); B41M 5/323 (2013.01); B41M 5/41 (2013.01); B41M 5/46 (2013.01); B42D 25/41 (2014.10); B41M 5/3275 (2013.01); B41M 5/3335 (2013.01); B41M 5/34 (2013.01); B41M 5/44 (2013.01); B41M 2205/04 (2013.01); B41M 2205/38 (2013.01); B41M 2205/42 (2013.01); B42D 25/23 (2014.10);
Abstract

The laminate includes: a base material; an intermediate layer provided on the base material and having an accommodation part; a recording medium provided in the accommodation part; and an overlay layer provided on the intermediate layer. The accommodation part is provided in a part of a plane of the intermediate layer, and the accommodation part is a through hole penetrating in the thickness direction of the intermediate layer or a recess recessed in the thickness direction of the intermediate layer. The recording medium includes a color development layer containing: a coloring compound having an electron donating property; a developer having an electron accepting property; and a matrix resin. The base material, the intermediate layer, and the overlay layer contain the same type of resin material. The base material and the intermediate layer are bonded to each other by fusion, and the intermediate layer and the overlay layer are bonded to each other by fusion.


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