The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 02, 2025

Filed:

Sep. 10, 2021
Applicant:

Arizona Board of Regents on Behalf of Arizona State University, Scottsdale, AZ (US);

Inventors:

Keng Hsu, Tempe, AZ (US);

Anagh Deshpande, Tempe, AZ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 20/10 (2006.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 70/00 (2020.01); B33Y 70/10 (2020.01);
U.S. Cl.
CPC ...
B23K 20/10 (2013.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 70/00 (2014.12); B33Y 70/10 (2020.01);
Abstract

Ultrasonic filament modeling systems and methods may be utilized to achieve room-temperature 3-D printing of solid (>95%) metal materials. A vibrating tool is applied to a metal filament to form a voxel, inducing mechanical deformation as well as inter- and intra-layer mass transport. Desired structures may be built on a voxel-by-voxel basis. Additionally, by varying the applied ultrasonic energy, the microstructure of the resulting structure may be controlled.


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Hsu, Keng. (2025). Systems and methods for additive manufacturing utilizing localized ultrasound-enhanced material flow and fusioning (U.S. Patent No. 12403545). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12403545

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