The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2025
Filed:
Jul. 22, 2021
Applicant:
Sensortek Technology Corp., Jhubei, TW;
Inventors:
Wen-Chieh Tsou, Jhubei, TW;
Yi-Hua Chang, Jhubei, TW;
Assignee:
Sensortek Technology Corp., Jhubei, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10F 55/25 (2025.01); H01L 25/16 (2023.01); H10F 77/50 (2025.01);
U.S. Cl.
CPC ...
H10F 55/25 (2025.01); H01L 25/167 (2013.01); H10F 77/50 (2025.01);
Abstract
A complex sensing device packaging structure and packaging method are disclosed. The packaging structure includes a substrate disposed with a light emitting element and a light sensing chip. A first non-transparent material is disposed on the light sensing chip. A transparent molding material surrounds the light emitting element, the light sensing chip and the first non-transparent material. A second non-transparent material is disposed inside the transparent molding material, and the second non-transparent material is connected with the first non-transparent material.