The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 26, 2025

Filed:

Sep. 30, 2022
Applicant:

United States of America As Represented BY the Secretary of the Army, Alexandria, VA (US);

Inventors:

Joshua D Wattier, Champaign, IL (US);

Nathaniel J Bidner, Champaign, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); G06F 1/18 (2006.01); G06F 1/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20272 (2013.01); G06F 1/181 (2013.01); G06F 1/182 (2013.01); G06F 1/183 (2013.01); G06F 1/20 (2013.01); H05K 7/20154 (2013.01); H05K 7/2039 (2013.01); G06F 2200/1633 (2013.01); G06F 2200/201 (2013.01); H05K 7/20181 (2013.01);
Abstract

In one embodiment, an enclosure device for a printed circuit board (PCB) comprises: an enclosure wall structure including therein a heater exchanger, a pipe to direct a cooling liquid through the heat exchanger, and a ducting to direct a gas through the heat exchanger to be cooled by the cooling liquid; and a PCB space adjacent to a portion of the enclosure wall structure for receiving the PCB. The ducting includes a downstream duct disposed downstream of the heat exchanger and extending through the portion of the enclosure wall structure adjacent to the PCB space to direct the cooled gas to the portion of the enclosure wall structure adjacent to the PCB space.


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