The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2025
Filed:
Feb. 13, 2023
Applicant:
Murata Manufacturing Co., Ltd., Kyoto, JP;
Inventor:
Takanori Uejima, Kyoto, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H03F 3/24 (2006.01); H04B 1/40 (2015.01);
U.S. Cl.
CPC ...
H05K 1/0243 (2013.01); H03F 3/245 (2013.01); H05K 1/0218 (2013.01); H04B 1/40 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/1006 (2013.01); H05K 2201/10098 (2013.01);
Abstract
A high-frequency module includes: a module board that has main surfaces which are opposed to each other; a plurality of high-frequency components that are arranged on at least one of the main surfaces; a resin member that covers at least one of the main surfaces and has a plurality of side surfaces along an outer edge of the module board; and a shield electrode layer that covers some of the side surfaces without covering other side surfaces.