The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 26, 2025

Filed:

Jan. 13, 2025
Applicant:

South China University of Technology, Guangzhou, CN;

Inventors:

Guoqiang Li, Guangzhou, CN;

Kaibin Xu, Guangzhou, CN;

Zhipeng Chen, Guangzhou, CN;

Han Hu, Guangzhou, CN;

Yuhan Zhu, Guangzhou, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/54 (2006.01); H03H 3/02 (2006.01); H03H 9/17 (2006.01);
U.S. Cl.
CPC ...
H03H 9/542 (2013.01); H03H 3/02 (2013.01); H03H 9/173 (2013.01);
Abstract

A method for preparing a hybrid filter on a chip with IPD and FBAR, includes: preparing a leakage isolation layer on a supporting substrate by deposition; obtaining an inductor layer on the leakage isolation layer, leaving a window at a bottom of a groove surrounding a cross section of a TGV inductor stack on a mask, and patterning an inductor metal simultaneously; forming a first insulating layer on the inductor metal, and forming lead through holes by photolithography; repeating steps and alternately to obtain a three-layer stacked TGV inductor; depositing a second insulating layer on the TGV inductor; depositing two capacitor layers on the second insulating layer, and depositing a third insulating layer between the two capacitor layers to form an MIM capacitor; and preparing a BAW resonator on the MIM capacitor, and connecting the TGV inductor, the MIM capacitor and the BAW resonator through the lead through holes.


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