The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 26, 2025

Filed:

Mar. 06, 2023
Applicants:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Toshiba Electronic Devices & Storage Corporation, Tokyo, JP;

Inventors:

Naoki Takahashi, Kanagawa, JP;

Akio Ogura, Kanagawa, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02H 5/04 (2006.01); G01K 3/00 (2006.01); G01R 19/00 (2006.01); G01R 31/28 (2006.01); H02H 1/00 (2006.01);
U.S. Cl.
CPC ...
H02H 5/04 (2013.01); G01K 3/005 (2013.01); G01R 19/0038 (2013.01); G01R 31/2851 (2013.01); H02H 1/0007 (2013.01);
Abstract

According to one embodiment, a semiconductor device includes, a first terminal, a second terminal, a third terminal, a first circuit configured to output a first signal of a first level if a temperature satisfies a condition, and a second circuit configured, if the first circuit outputs the first signal of the first level, to provide electrical insulation between the second terminal and the third terminal, wherein the first circuit includes an element provided between a first interconnect and the first terminal, and the first circuit outputs the first signal of the first level regardless of the temperature if a first voltage is supplied to the first interconnect.


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