The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 26, 2025

Filed:

Sep. 27, 2023
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventor:

Yoshihito Otsubo, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/52 (2011.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01R 12/52 (2013.01); H05K 1/181 (2013.01); H05K 2201/042 (2013.01); H05K 2201/10234 (2013.01); H05K 2201/10318 (2013.01); H05K 2201/10522 (2013.01); H05K 2201/10545 (2013.01);
Abstract

A circuit module includes an upper circuit board, a lower circuit board, a first conductor member, a second conductor member, and a first component. The upper circuit board has a first upper main surface and a first lower main surface. The lower circuit board has a second upper main surface and a second lower main surface, is disposed below the upper circuit board, and overlaps the upper circuit board as viewed in the downward direction. The first component is mounted on the first lower main surface or the second upper main surface. The first conductor member is a metal pin and is connected to the first lower main surface. The second conductor member is a metal pin and is connected to the second upper main surface. The second conductor member is electrically connected to the first conductor member.


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