The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 26, 2025

Filed:

Feb. 28, 2023
Applicant:

L3harris Technologies, Inc., Melbourne, FL (US);

Inventors:

Pedro Rodriguez-Garcia, Heath, TX (US);

Joshua Martin, Rockwall, TX (US);

James Pierpont, Allen, TX (US);

Robert George, Caddo Mills, TX (US);

Philip Clayton Weatherly, Terrell, TX (US);

Emily Marie Tobar, Rockwall, TX (US);

Assignee:

L3Harris Technologies, Inc., Melbourne, FL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 13/08 (2006.01); H01Q 1/48 (2006.01); H01Q 21/24 (2006.01); H01Q 21/06 (2006.01);
U.S. Cl.
CPC ...
H01Q 13/085 (2013.01); H01Q 1/48 (2013.01); H01Q 21/24 (2013.01); H01Q 21/064 (2013.01);
Abstract

In some aspects, the techniques described herein relate to an apparatus including: a ground plane element including: a non-conductive support layer, a conductive layer arranged on the non-conductive support layer, and at least one orifice through the non-conductive support layer and the conductive laminate layer; one or more radiating elements including a feed line and a solder pad, wherein each of the one or more radiating elements is secured to and electrically connected to the ground plane element via soldering of the solder pad to the conductive laminate layer; and at least one connector arranged in the at least one orifice and electrically connected to the feed line.


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