The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 26, 2025

Filed:

Mar. 04, 2022
Applicant:

Lite-on Technology Corporation, Taipei, TW;

Inventors:

Chen-Hsiu Lin, New Taipei, TW;

Shirley Sia, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2023.01); H10F 77/00 (2025.01); H10F 77/40 (2025.01); H10F 77/50 (2025.01); H10H 20/85 (2025.01); H10H 20/856 (2025.01); H10H 20/857 (2025.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H01L 25/165 (2013.01); H10F 77/407 (2025.01); H10F 77/50 (2025.01); H10F 77/933 (2025.01); H10H 20/8506 (2025.01); H10H 20/856 (2025.01); H10H 20/857 (2025.01);
Abstract

An optoelectronic package structure and a photo-interrupting device are provided. The photo-interrupting device includes a casing and two optoelectronic package structures oppositely arranged. The optoelectronic package structure includes a housing, a first lead frame, a second lead frame, an optoelectronic element, and a sealing element. The optoelectronic element is disposed on the first lead frame and is electrically connected to the second lead frame through a conducting wire. The housing encapsulates one part of each of the first lead frame and the second lead frame. Another part of each of the first lead frame and the second lead frame correspondingly protrudes from one end of the housing having an opening arranged on a first surface, and the optoelectronic element is exposed through the opening. The sealing element covers the optoelectronic element, and a surface of the sealing element is not higher than the first surface of the housing.


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