The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2025
Filed:
Jul. 21, 2021
Applicant:
Graphcore Limited, Bristol, GB;
Inventors:
Simon Jonathan Stacey, Bristol, GB;
Yang Chih Wang, Kaohsiung, TW;
Assignee:
GRAPHCORE LIMITED, Bristol, GB;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/768 (2006.01); H01L 23/14 (2006.01); H01L 23/498 (2006.01); H01L 23/532 (2006.01); H05K 1/09 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 21/768 (2013.01); H01L 23/14 (2013.01); H01L 23/49816 (2013.01); H01L 23/53228 (2013.01); H01L 24/14 (2013.01); H05K 1/09 (2013.01); H05K 1/181 (2013.01);
Abstract
A substrate and a method for manufacturing the substrate. The substrate is suitable for mounting at least one semiconductor die onto a printed circuit board. The substrate comprises two opposing stacks, with each stack comprising alternating layers of copper and electrically insulating film. The film and the copper have different co-efficients of thermal expansion, allowing the warpage behaviour of the substrate to be controlled by providing the substrate with different film thicknesses between the opposing stacks.