The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2025
Filed:
Oct. 23, 2023
Qualcomm Incorporated, San Diego, CA (US);
Bharani Chava, San Diego, CA (US);
Abinash Roy, San Diego, CA (US);
Stanley Seungchul Song, San Diego, CA (US);
Jonghae Kim, San Diego, CA (US);
QUALCOMM INCORPORATED, San Diego, CA (US);
Abstract
A package comprising a substrate; a first integrated device coupled to the substrate through at least a first plurality of solder interconnects; a second integrated device coupled to the substrate through at least a second plurality of solder interconnects; a first bridge coupled to the first integrated device and the second integrated device through at least a third plurality of solder interconnects, wherein the first bridge is configured to provide at least one first electrical path between the first integrated device and the second integrated device, and wherein the first bridge is coupled to a top portion of the first integrated device and a top portion of the second integrated device, through at least the third plurality of solder interconnects; and a second bridge coupled to the first integrated device and the second integrated device through a fourth plurality of solder interconnects.