The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2025
Filed:
Apr. 14, 2023
Applicants:
Hyundai Motor Company, Seoul, KR;
Kia Corporation, Seoul, KR;
Inventors:
Assignees:
Hyundai Motor Company, Seoul, KR;
Kia Corporation, Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 23/498 (2006.01); H01L 25/07 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5385 (2013.01); H01L 23/49811 (2013.01); H01L 25/072 (2013.01);
Abstract
A power module includes an upper substrate, a lower substrate, a first semiconductor chip, a first spacer configured to electrically connect a first metal layer to a second metal layer, a second spacer configured to electrically connect the first semiconductor chip to the first metal layer, a first connection layer having conductivity, disposed between the upper substrate and the lower substrate, and configured to allow the first spacer and the second spacer to penetrate the first connection layer, and a power lead.