The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2025
Filed:
Dec. 22, 2021
Applicant:
Denso Corporation, Kariya, JP;
Inventors:
Akihiro Yamaguchi, Kariya, JP;
Norihisa Imaizumi, Kariya, JP;
Ryuma Kamikomaki, Kariya, JP;
Kouji Kondoh, Kariya, JP;
Hirotaka Miyano, Kariya, JP;
Tomohiro Yokochi, Kariya, JP;
Gentarou Masuda, Kariya, JP;
Assignee:
DENSO CORPORATION, Kariya, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/29 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/373 (2006.01); H01L 23/473 (2006.01); H01L 25/16 (2023.01); H10D 64/23 (2025.01); H10D 64/27 (2025.01);
U.S. Cl.
CPC ...
H01L 23/293 (2013.01); H01L 21/561 (2013.01); H01L 23/3735 (2013.01); H01L 23/473 (2013.01); H01L 24/24 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/82 (2013.01); H01L 24/97 (2013.01); H01L 25/162 (2013.01); H01L 2224/244 (2013.01); H01L 2224/245 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/32225 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/10344 (2013.01); H01L 2924/13064 (2013.01); H10D 64/257 (2025.01); H10D 64/519 (2025.01);
Abstract
A semiconductor package includes a semiconductor chip, a heat radiating member on which the semiconductor chip is mounted, and a sealing member sealing the semiconductor chip. The sealing member is made of a liquid crystal polymer.