The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12400790 B1

Date of Patent:

Aug. 26, 2025

Filed:

Mar. 14, 2023

Multilayer electronic component

Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Dae Woo Yoon, Suwon-si, KR;

Bum Suk Kang, Suwon-si, KR;

Da Mi Kim, Suwon-si, KR;

Su Jin Lee, Suwon-si, KR;

Assignee:

SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;

Attorney:

MORGAN, LEWIS & BOCKIUS LLP

Primary Examiner:

Michael P McFadden

Int. Cl.

CPC ...

H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01); H01G 4/30 (2006.01);

U.S. Cl.

CPC ...

H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/1227 (2013.01); H01G 4/30 (2013.01);

Abstract

A multilayer electronic component according to an embodiment of the present disclosure includes: a body including a dielectric layer and internal electrodes; and an electrode layer disposed on the body and connected to the internal electrodes; and the electrode layer includes Cu particles and glass, wherein oxides including Cu is disposed on at least a portion of the interface between the Cu particles and the glass.

Find Patent Forward Citations

Yoon, Dae. (2025). Multilayer electronic component (U.S. Patent No. 12400790). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12400790

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