The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 26, 2025

Filed:

May. 16, 2024
Applicant:

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Meijuan Zhang, Beijing, CN;

Yaoping Wang, Beijing, CN;

Zhaoyue Li, Beijing, CN;

Yuanyuan Lu, Beijing, CN;

Dong Chai, Beijing, CN;

Hong Wang, Beijing, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G07C 3/14 (2006.01); B29C 45/76 (2006.01); G01N 21/88 (2006.01); G06F 11/3668 (2025.01); G06F 18/2451 (2023.01); G06Q 10/0639 (2023.01); G06T 7/00 (2017.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
G07C 3/14 (2013.01); B29C 45/76 (2013.01); G01N 21/8851 (2013.01); G06F 11/3688 (2013.01); G06F 18/2451 (2023.01); G06Q 10/06395 (2013.01); G06T 7/001 (2013.01); H01L 21/67288 (2013.01); G01N 2021/8887 (2013.01);
Abstract

A method and a device for processing product manufacturing messages, and an electronic device are disclosed. The method for processing product manufacturing messages includes: monitoring a plurality of product manufacturing messages; establishing a product defect analysis task queue based on the plurality of product manufacturing messages; distributing product defect analysis tasks to product manufacturing assisting devices based on the product defect analysis task queue, wherein the product defect analysis tasks include a task of identifying product defect content based on a defect identification model; wherein the product defect content includes any one or more of: product defect type, product defect location, and product defect size.


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