The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 26, 2025

Filed:

Nov. 04, 2022
Applicant:

Cloud Light Technology Limited, Hong Kong, HK;

Inventor:

Wing Keung Mark Mak, Hong Kong, HK;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/30 (2006.01);
U.S. Cl.
CPC ...
G02B 6/30 (2013.01);
Abstract

The present disclosure provides an optical fiber to silicon photonics circuit (PIC) assembly method utilizing a structured fiber retaining apparatus for fiber confinement in which polymer filling volume for adhesion and refractive index matching purpose is reduced. Reduction of polymer volume result in smaller optical alignment change due to polymer material volume changes upon moisture absorption and aging, hence improving assembly reliability. In an embodiment, the assembly method and apparatus, transparent polymer material interfaces between fiber and edged coupler volume reduce more than 50% compares to conventional assembly method.


Find Patent Forward Citations

Mak, Wing Keung Mark. (2025). Fiber to silicon photonics assembly method with fiber retaining apparatus (U.S. Patent No. 12399325). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12399325

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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