The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 26, 2025

Filed:

Apr. 17, 2019
Applicants:

Raytheon Company, Waltham, MA (US);

Thermavant Technologies, Llc, Columbia, MO (US);

Inventors:

Tuan L. Duong, Santa Barbara, CA (US);

Adam D. Leeds, Santa Barbara, CA (US);

James E. Benedict, Tewksbury, MA (US);

Joseph A Boswell, San Francisco, CA (US);

Daniel A. Pounds, Columbia, MO (US);

Assignees:

Raytheon Company, Arlington, VA (US);

ThermAvant Technologies, LLC, Columbia, MO (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F03G 7/06 (2006.01); B64G 1/50 (2006.01); F28D 15/02 (2006.01); F28D 21/00 (2006.01); F28F 3/12 (2006.01); F42B 15/34 (2006.01);
U.S. Cl.
CPC ...
F03G 7/0614 (2021.08); B64G 1/503 (2013.01); B64G 1/506 (2013.01); F28D 15/0208 (2013.01); F28F 3/12 (2013.01); F28D 2021/0021 (2013.01); F28F 2255/04 (2013.01); F42B 15/34 (2013.01);
Abstract

An apparatus includes a structure configured to receive thermal energy and to reject the thermal energy into an external environment. The structure includes a lid and a body. The structure also includes (i) multiple inline and interconnected thermomechanical regions and (ii) one or more oscillating heat pipes embedded in at least some of the thermomechanical regions. Different portions of at least one of the lid and the body form the thermomechanical regions. The one or more oscillating heat pipes are configured to transfer the thermal energy between different ones of the thermomechanical regions. At least one of the thermomechanical regions includes one or more shape-memory materials configured to cause a shape of the structure to change. Each of the one or more oscillating heat pipes includes at least one channel in the structure.


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