The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 26, 2025

Filed:

Mar. 25, 2021
Applicant:

Jfe Steel Corporation, Tokyo, JP;

Inventors:

Kenichiro Eguchi, Tokyo, JP;

Masao Yuga, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C21D 9/08 (2006.01); C21D 8/10 (2006.01); C22C 38/00 (2006.01); C22C 38/02 (2006.01); C22C 38/04 (2006.01); C22C 38/06 (2006.01); C22C 38/44 (2006.01); C22C 38/46 (2006.01); C22C 38/52 (2006.01);
U.S. Cl.
CPC ...
C21D 9/08 (2013.01); C21D 8/105 (2013.01); C22C 38/001 (2013.01); C22C 38/002 (2013.01); C22C 38/004 (2013.01); C22C 38/02 (2013.01); C22C 38/04 (2013.01); C22C 38/06 (2013.01); C22C 38/44 (2013.01); C22C 38/46 (2013.01); C22C 38/52 (2013.01); C21D 2211/001 (2013.01); C21D 2211/008 (2013.01);
Abstract

A high-strength stainless steel seamless pipe for oil country tubular goods has a composition that comprises, in mass %, C: 0.002 to 0.05%, Si: 0.05 to 0.50%, Mn: 0.04 to 1.80%, P: 0.030% or less, S: 0.002% or less, Cr: more than 14.0% and 17.0% or less, Ni: 4.0 to 8.0%, Mo: 1.5 to 3.0%, Al: 0.005 to 0.10%, V: 0.005 to 0.20%, Co: 0.01 to 1.0%, N: 0.002 to 0.15%, and O: 0.006% or less, and that satisfies the predetermined formulae, and in which the balance is Fe and incidental impurities, the high-strength stainless steel seamless pipe having a microstructure containing prior austenite having an average grain size of 40 μm or less, the high-strength stainless steel seamless pipe having a yield strength of 758 MPa or more.


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