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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12397487 B1

PDFFull Text
Date of Patent:
Aug. 26, 2025

Filed:

Jun. 17, 2021

Method for producing a component having a cooling channel system

Applicant:

Dmg Mori Ultrasonic Lasertec Gmbh, Stipshausen, DE;

Inventor:

Andreas Müller, Weitnau, DE;

Assignee:

DMG MORI Ultrasonic Lasertec GmbH, Stipshausen, DE;

Attorney:

Henricks Slavin LLP

Primary Examiner:

Jamel M Nelson

Assistant Examiner:

Erica Hartsell Funk

Int. Cl.
CPC ...
B29C 45/73 (2006.01); B22F 5/10 (2006.01); B22F 10/20 (2021.01); B22F 10/50 (2021.01); B22F 10/66 (2021.01); B22F 12/84 (2021.01); B23K 26/00 (2014.01); B23K 26/342 (2014.01); B23P 15/00 (2006.01); B29C 33/04 (2006.01); B29C 33/38 (2006.01); C22C 1/04 (2023.01); G05B 19/4099 (2006.01); B23K 101/14 (2006.01); B23K 103/12 (2006.01); B33Y 10/00 (2015.01); B33Y 80/00 (2015.01); G06F 113/22 (2020.01);
U.S. Cl.
CPC ...
B29C 45/7312 (2013.01); B22F 5/10 (2013.01); B22F 10/20 (2021.01); B22F 10/50 (2021.01); B22F 10/66 (2021.01); B22F 12/84 (2021.01); B23K 26/0006 (2013.01); B23K 26/342 (2015.10); B23P 15/007 (2013.01); B29C 33/04 (2013.01); B29C 33/3835 (2013.01); C22C 1/0425 (2013.01); G05B 19/4099 (2013.01); B22F 2998/10 (2013.01); B23K 2101/14 (2018.08); B23K 2103/12 (2018.08); B29C 2045/7318 (2013.01); B33Y 10/00 (2014.12); B33Y 80/00 (2014.12); G06F 2113/22 (2020.01);
Abstract

The invention provides a method for producing a component () having a cooling channel system, the method comprising: building a first portion () of the component () by means of the additive, integrally bonded application of a build material; and—introducing a first cavity () having an opening into the first portion () of the component (). The method is characterized in that it also comprises: covering the opening of the first cavity () in the first portion () by means of a covering part ();—building a second portion () of the component () by means of the additive, integrally bonded application of the build material, the build material being applied to the first portion () and to the covering part (); introducing a second cavity () having an opening into the second portion () of the component (); and—introducing a connecting channel (), () into the component () by means of material-removing machining in order to form the cooling channel system, the connecting channel (), () connecting the second cavity () of the second portion () to the first cavity () of the first portion () of the component ().

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