The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2025
Filed:
Mar. 16, 2022
Applicant:
Black & Decker Inc., New Britain, CT (US);
Inventors:
Daniel J. White, Baldwin, MD (US);
Matthew J. Velderman, Baltimore, MD (US);
Michael Varipatis, Fallston, MD (US);
Nathan J. Osborne, Baltimore, MD (US);
Assignee:
BLACK & DECKER INC., New Britain, CT (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B25F 5/02 (2006.01); B25F 5/00 (2006.01); H01M 10/04 (2006.01); H01M 10/42 (2006.01); H01M 10/44 (2006.01); H01M 50/213 (2021.01); H01M 50/244 (2021.01); H01M 50/247 (2021.01); H01M 50/296 (2021.01); H01M 50/588 (2021.01); H01M 50/597 (2021.01); H02J 5/00 (2016.01); H02J 7/00 (2006.01); H02J 7/02 (2016.01); H02J 7/36 (2006.01); H02P 25/14 (2006.01); H02P 27/08 (2006.01); H02P 29/00 (2016.01); H02P 29/024 (2016.01); H02P 29/032 (2016.01); H01M 10/46 (2006.01);
U.S. Cl.
CPC ...
B25F 5/02 (2013.01); B25F 5/00 (2013.01); H01M 10/0445 (2013.01); H01M 10/4207 (2013.01); H01M 10/425 (2013.01); H01M 50/213 (2021.01); H01M 50/244 (2021.01); H01M 50/247 (2021.01); H01M 50/296 (2021.01); H01M 50/588 (2021.01); H01M 50/597 (2021.01); H02J 5/00 (2013.01); H02J 7/0013 (2013.01); H02J 7/0024 (2013.01); H02J 7/0029 (2013.01); H02J 7/0045 (2013.01); H02J 7/007 (2013.01); H02J 7/00714 (2020.01); H02J 7/02 (2013.01); H02J 7/36 (2013.01); H02P 25/14 (2013.01); H02P 27/08 (2013.01); H02P 29/00 (2013.01); H02P 29/024 (2013.01); H02P 29/0241 (2016.02); H02P 29/032 (2016.02); H01M 10/441 (2013.01); H01M 10/46 (2013.01); H01M 2220/30 (2013.01); H02J 7/00045 (2020.01);
Abstract
A method of manufacturing a battery pack including the creation of a support board for enabling conversion of the battery pack from providing a first voltage to providing a second voltage. The support board is created by injection molding about a precut set of power traces for coupling a converting element to a plurality of battery cells. The power traces couple the plurality of battery cells to a set of battery pack terminals. The support board may be mechanically coupled to a battery cell holder.