The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 26, 2025

Filed:

Sep. 01, 2020
Applicant:

Solventum Intellectual Properties Company, Maplewood, MN (US);

Inventors:

Christopher Brian Locke, Bournemouth, GB;

Timothy Mark Robinson, Shillingstone, GB;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/24 (2006.01); A61F 13/02 (2006.01); A61F 13/0203 (2024.01); A61F 13/0246 (2024.01); A61F 13/05 (2024.01); A61L 15/26 (2006.01); A61L 15/58 (2006.01); A61M 1/00 (2006.01); B32B 5/02 (2006.01); B32B 7/12 (2006.01); B32B 37/12 (2006.01); B32B 38/04 (2006.01); B32B 3/26 (2006.01);
U.S. Cl.
CPC ...
A61F 13/0223 (2013.01); A61F 13/023 (2013.01); A61F 13/025 (2013.01); A61F 13/0289 (2013.01); A61F 13/05 (2024.01); A61L 15/26 (2013.01); A61L 15/58 (2013.01); A61M 1/90 (2021.05); B32B 5/02 (2013.01); B32B 7/12 (2013.01); B32B 37/12 (2013.01); B32B 38/04 (2013.01); A61L 2420/02 (2013.01); B32B 3/266 (2013.01); B32B 2037/1253 (2013.01); B32B 2038/047 (2013.01); B32B 2307/726 (2013.01); B32B 2535/00 (2013.01); Y10T 428/24331 (2015.01); Y10T 428/24339 (2015.01);
Abstract

Sealing members and methods of manufacturing the same are described. A first film layer and a second film layer each having a first side and a second side can be provided. A first adhesive can be coupled to the second side of the first film layer to form a first adhesive layer. A second adhesive can be coupled to the second side of the second film layer to form a second adhesive layer, and a third adhesive can be coupled to the first side of the second film layer to form a third adhesive layer. One or more perforations can be formed through the third adhesive layer, the second film layer, and the second adhesive layer. A first side of the third adhesive layer can be coupled to a second side of the first adhesive layer.


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