The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 19, 2025

Filed:

Jun. 07, 2022
Applicant:

Microchip Technology Incorporated, Chandler, AZ (US);

Inventor:

Yaojian Leng, Vancouver, WA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 1/47 (2025.01); H01C 7/00 (2006.01); H01C 17/075 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01); H10D 86/85 (2025.01);
U.S. Cl.
CPC ...
H10D 1/474 (2025.01); H01C 7/006 (2013.01); H01C 17/075 (2013.01); H01L 21/76816 (2013.01); H01L 21/76843 (2013.01); H01L 23/5228 (2013.01); H10D 86/85 (2025.01);
Abstract

A thin film resistor (TFR) module includes a metal cup structure, a dielectric liner region, a TFR element, and a pair of TFR heads electrically connected to the TFR element. The metal cup structure includes a laterally-extending metal cup base and multiple metal cup sidewalls extending upwardly from the laterally-extending metal cup base. The dielectric liner region is formed in an opening defined by the metal cup structure. The TFR element is formed in an opening defined by the dielectric liner region, wherein the TFR element is insulated from the metal cup structure by the dielectric liner region.


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