The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 19, 2025

Filed:

Sep. 29, 2022
Applicant:

Tatsuta Electric Wire & Cable Co., Ltd., Higashiosaka, JP;

Inventors:

Katsuma Ookura, Kyoto, JP;

Yoshiharu Yanagi, Kyoto, JP;

Hiroshi Tajima, Kizugawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0084 (2013.01);
Abstract

An electromagnetic wave shielding film with high bending resistance includes a protecting layer, a metal layer, and an adhesive layer stacked in this order. A ratio of Repulsion Y to Repulsion X ([Repulsion Y]/[Repulsion X]) is 0.77 or higher, where Repulsion X denotes a repulsion of a stack including the protecting layer and the metal layer measured in a defined test for measuring repulsion of stacks, and Repulsion Y denotes a repulsion of the adhesive layer measured in a defined test for measuring repulsion of adhesive layers.


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