The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 19, 2025
Filed:
Mar. 04, 2022
Applicant:
Samsung Display Co., Ltd., Yongin-si, KR;
Inventors:
Assignee:
SAMSUNG DISPLAY CO., LTD., Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/28 (2006.01); H01L 25/18 (2023.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); H10K 59/131 (2023.01); H10K 59/80 (2023.01);
U.S. Cl.
CPC ...
H05K 3/281 (2013.01); H05K 1/147 (2013.01); H05K 1/189 (2013.01); H05K 3/288 (2013.01); H10K 59/871 (2023.02); H01L 25/18 (2013.01); H05K 2201/10128 (2013.01); H05K 2203/304 (2013.01); H10K 59/131 (2023.02); H10K 59/873 (2023.02);
Abstract
A release film on a printed circuit board and a connector connected to the printed circuit board includes a first release film disposed on a first surface of the printed circuit board and a surface of the connector, a second release film disposed on a second surface of the printed circuit board opposite to the first surface of the printed circuit board, and a first adhesive attached to a portion of a surface of the first release film that does not overlap the second release film, extending towards the second release film and covering a portion of a surface of the second release film that does not face the first release film.