The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 19, 2025
Filed:
Jun. 30, 2023
Unimicron Technology Corp., Taoyuan, TW;
National Taiwan University, Taipei, TW;
Chin-Hsun Wang, Taipei, TW;
Ruey-Beei Wu, Taipei, TW;
Chun-Jui Huang, Taoyuan, TW;
Wei-Yu Liao, Taoyuan, TW;
Ching-Sheng Chen, Taoyuan, TW;
Chi-Min Chang, Taoyuan, TW;
NATIONAL TAIWAN UNIVERSITY, Taipei, TW;
Abstract
A circuit board device includes a transition region that includes a first conductive layer at a first level, a second conductive layer at a second level, and conductive vias. The first conductive layer includes a pad connected to the solderless connector, a transmission line, and a first reference layer. The transmission line includes first and second segments. A second width of the second segment is the same as or less than a first width of the first segment. The first reference layer has a first anti-pad region for the pad and the transmission line disposed therein. In a plan view, the first anti-pad region surrounding the pad is completely located within a second anti-pad region of a second reference layer of the second conductive layer. The conductive vias are disposed between the first and second conductive layers and surround the pad.