The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 19, 2025

Filed:

Mar. 08, 2023
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventor:

Shuichi Nakamura, Chiba, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/40 (2006.01); H05K 9/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0224 (2013.01); H05K 1/115 (2013.01); H05K 3/4038 (2013.01); H05K 9/0032 (2013.01); H05K 2201/10984 (2013.01);
Abstract

An electronic device that is capable of keeping the impedance (ground impedance) between a printed circuit board and a shield case low. The electronic device includes a printed circuit board that has ground layer(s) which is conductive and is provided at a location in the thickness direction of the printed circuit board, and the shield case which is disposed on one side of the printed circuit board and consists of a hollow body that has conductivity. A through hole(s) passing through the ground layer is formed in the printed circuit board. A projecting portion(s), which is inserted into the through hole(s), is formed in a projecting manner in the shield case. In a state of being inserted in the through hole(s), the projecting portion(s) is electrically connected to the ground layer via solder.


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