The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 19, 2025

Filed:

Sep. 02, 2021
Applicant:

Sew-eurodrive Gmbh & Co. KG, Bruchsal, DE;

Inventors:

Jochen Mahlein, Karlsruhe, DE;

Leobald Podbielski, Karlsruhe, DE;

Martin Filsinger, Kraichtal, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0206 (2013.01); H05K 1/0298 (2013.01); H05K 2201/066 (2013.01);
Abstract

A printed circuit board (PCB) includes a top side for receiving electrical components, a bottom side for receiving a heat sink, electrically conductive layers, and electrically insulating insulation layers. A main insulation layer is arranged between the top and bottom sides. The main insulation layer completely electrically insulates electrically conductive layers arranged between the main insulation layer and the top side from electrically conductive layers arranged between the main insulation layer and the bottom side. Upper plated through-holes extend from an outer insulation layer adjacent the top side into an inner insulation layer adjacent the main insulation layer. Lower plated through-holes extend from the bottom side into a lower insulation layer adjacent the main insulation layer. A circuit arrangement includes the printed circuit board, electrical components fitted to the top side and connected to the PCB, and heat sink(s) fitted to the bottom side and connected to the PCB.


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