The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 19, 2025

Filed:

Feb. 09, 2023
Applicant:

Skyworks Global Pte. Ltd., Singapore, SG;

Inventors:

Yu Hui, Merced, CA (US);

Kwang Jae Shin, Yongin, KR;

Assignee:

Skyworks Global Pte. Ltd., Singapore, SG;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 17/02 (2006.01); B81B 3/00 (2006.01); H04R 1/04 (2006.01); H04R 7/10 (2006.01); H04R 19/04 (2006.01);
U.S. Cl.
CPC ...
H04R 17/02 (2013.01); B81B 3/0072 (2013.01); H04R 1/04 (2013.01); H04R 7/10 (2013.01); H04R 19/04 (2013.01); B81B 2201/0257 (2013.01); B81B 2203/0127 (2013.01); B81B 2203/019 (2013.01); B81B 2203/04 (2013.01); H04R 2201/003 (2013.01); H04R 2420/07 (2013.01); H04R 2499/11 (2013.01);
Abstract

A piezoelectric microelectromechanical systems diaphragm microphone can be mounted on a printed circuit board. The microphone can include a substrate with an opening between a bottom end of the substrate and a top end of the substrate. The microphone can have two or more piezoelectric film layers disposed over the top end of the substrate and defining a diaphragm structure. Each of the two or more piezoelectric film layers can have a predefined residual stress that substantially cancel each other out so that the diaphragm structure is substantially flat with substantially zero residual stress. The microphone can include one or more electrodes disposed over the diaphragm structure. The diaphragm structure is configured to deflect when the diaphragm is subjected to sound pressure via the opening in the substrate.


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