The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 19, 2025
Filed:
Jun. 27, 2023
Applicant:
Avicenatech Corp., Sunnyvale, CA (US);
Inventors:
Robert Kalman, Menlo Park, CA (US);
Bardia Pezeshki, Menlo Park, CA (US);
Alexander Tselikov, Sunnyvale, CA (US);
Cameron Danesh, Sunnyvale, CA (US);
Assignee:
AvicenaTech, Corp., Sunnyvale, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 10/40 (2013.01); G02B 6/42 (2006.01); G02B 6/43 (2006.01); H04B 10/50 (2013.01);
U.S. Cl.
CPC ...
H04B 10/40 (2013.01); G02B 6/4246 (2013.01); G02B 6/43 (2013.01); H04B 10/502 (2013.01);
Abstract
Optical chip-to-chip interconnects may use microLEDs as light sources. The interconnected chips may be on a same substrate. A pair of endpoint chips may each have associated optical transceiver subsystems, with transceiver circuitry in transceiver chips. Optical communications may be provided between the optical transceiver subsystems, with the optical transceiver subsystems in communication with their associated endpoint chips by way of metal layers in the substrate.