The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 19, 2025

Filed:

Apr. 29, 2022
Applicants:

Ihp Gmbh-innovations for High Performance Microelectronics/leibniz-instit. Für Innovative Mikroelektronik, Frankfurt, DE;

Technische Universität Berlin, Berlin, DE;

Inventors:

Norbert Herfurth, Frankfurt, DE;

Marco Lisker, Frankfurt, DE;

Elham Amini, Berlin, DE;

Christian Boit, Berlin, DE;

Jean-Pierre Seifert, Werder, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2023.01); G06F 21/87 (2013.01); H01L 23/00 (2006.01); H10F 55/25 (2025.01); H10H 20/01 (2025.01); H10H 20/80 (2025.01); H10H 20/82 (2025.01); H10H 20/857 (2025.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); G06F 21/87 (2013.01); H01L 23/573 (2013.01); H10F 55/25 (2025.01); H10H 20/018 (2025.01); H10H 20/82 (2025.01); H10H 20/857 (2025.01); H10H 20/882 (2025.01);
Abstract

A semiconductor device, a method of operating the semiconductor device, and a method of fabricating the semiconductor device are disclosed. The semiconductor device comprises a substrate stack comprising two permanently bonded semiconductor bodies stacked in a depth direction that points perpendicularly from a front side towards a back side of the substrate stack, and which share a buried bonding interface. One of the semiconductor bodies, the protection body, comprises an active region with a light emitter at the buried bonding interface, and a light absorption region which is opaque for light emitted from the light emitter. Another of the semiconductor bodies, the circuit body, extends from the buried bonding interface to the front side, is transmissive for the light emitted from the light emitter, and comprises a light detector at the front side to provide a detector signal indicative of a detected light intensity of light emitted from the light emitter and transmitted through the circuit body. A driver unit of the semiconductor device is configured to drive operation of the light emitters using predetermined operation parameters.


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