The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 19, 2025

Filed:

Jan. 03, 2023
Applicant:

Fuji Electric Co., Ltd., Kanagawa, JP;

Inventors:

Motohito Hori, Nagano, JP;

Yoshinari Ikeda, Nagano, JP;

Akira Hirao, Nagano, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/16 (2006.01); H01L 23/40 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/16 (2013.01); H01L 23/4006 (2013.01); H01L 23/49811 (2013.01); H01L 2023/4031 (2013.01); H01L 2023/4087 (2013.01);
Abstract

A semiconductor device includes a semiconductor module that includes: an insulating circuit board, a semiconductor chip provided on a main surface of the insulating circuit board, and an external connection terminals provided on the main surface of the insulating circuit board; an external printed circuit board provided so as to face a main surface of the semiconductor module, the external printed circuit board having a through hole into which the external connection terminal is inserted; and an elastic member provided between the main surface of the semiconductor module and the external printed circuit board so as to apply a pressing force to the main surface of the semiconductor module.


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