The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 19, 2025
Filed:
Jun. 10, 2022
Samsung Electronics Co., Ltd., Suwon-si, KR;
Junghoo Yun, Hwaseong-si, KR;
Jaemoon Lim, Hwaseong-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A method of testing a semiconductor device includes forming conductive bumps respectively on a plurality of bonding pads of the semiconductor device. The semiconductor device having the conductive bumps is supported on a substrate stage. A gripper having first and second holders spaced apart from each other is positioned over the conductive bump. The conductive bump is clamped between the first and second holders. The gripper clamping the conductive bump is reciprocated at a constant speed with a predetermined stroke in a horizontal direction parallel with an upper surface of the substrate stage. A reliability of the semiconductor device is determined by measuring a time point at which a crack occurs in an upper wiring connected to the bonding pad.