The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 19, 2025
Filed:
Dec. 14, 2022
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Byung Hoon Ko, Suwon-si, KR;
Seung Woo Noh, Suwon-si, KR;
Sang Yun Park, Suwon-si, KR;
Jin Woo Choi, Suwon-si, KR;
Youn Ho Kim, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/68 (2006.01); G01B 11/14 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01); G01B 7/14 (2006.01); G12B 9/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/68 (2013.01); G01B 11/14 (2013.01); H01L 21/67259 (2013.01); H01L 21/68707 (2013.01); G01B 7/14 (2013.01); G12B 9/02 (2013.01);
Abstract
A wafer-type sensor for wafer alignment includes a dummy wafer; a sensor module disposed in the dummy wafer, and a processor configured to control the sensor module to measure a distance between a side surface of the dummy wafer and a ring formed around a periphery of an electrostatic chuck based on the dummy wafer being mounted on the electrostatic chuck by a transfer robot.