The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 19, 2025

Filed:

Mar. 15, 2022
Applicant:

Murata Manufacturing Co., Ltd., Kyoto-fu, JP;

Inventors:

Ryuichiro Tominaga, Nagaokakyo, JP;

Keisuke Kunimori, Nagaokakyo, JP;

Yuuki Kawakami, Nagaokakyo, JP;

Yoshimasa Yoshioka, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/29 (2006.01); H01F 17/00 (2006.01); H01F 17/04 (2006.01); H01F 41/04 (2006.01);
U.S. Cl.
CPC ...
H01F 27/292 (2013.01); H01F 17/0013 (2013.01); H01F 17/04 (2013.01); H01F 41/041 (2013.01); H01F 2017/0066 (2013.01); H01F 2017/048 (2013.01);
Abstract

A coil component includes a main body made of a magnetic material, a linear inductor wiring conductor arranged in the main body, an electrically insulating pedestal having a top surface extending along the inductor wiring conductor in the main body and a pair of side surfaces each extending from both outer edges of the top surface in a direction intersecting the top surface, and a conductive seed layer provided over an entire region of at least a region sandwiched between the top surface of the pedestal and the inductor wiring conductor. When a width dimension of a surface of the inductor wiring conductor in contact with the seed layer is defined as a first width dimension and a width dimension of the seed layer is defined as a second width dimension, the second width dimension is larger than the first width dimension.


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