The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 19, 2025

Filed:

Oct. 18, 2021
Applicant:

Zhejiang University, Hangzhou, CN;

Inventors:

Jianfeng Ping, Hangzhou, CN;

Yuzhou Shao, Hangzhou, CN;

Yibin Ying, Hangzhou, CN;

Assignee:

ZHEJIANG UNIVERSITY, Hangzhou, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06K 19/077 (2006.01); C09D 11/30 (2014.01); C09D 11/322 (2014.01); C09D 11/52 (2014.01); G06K 19/07 (2006.01);
U.S. Cl.
CPC ...
G06K 19/07756 (2013.01); C09D 11/52 (2013.01); G06K 19/0717 (2013.01); G06K 19/0723 (2013.01); G06K 19/07775 (2013.01); G06K 19/0779 (2013.01); G06K 19/07786 (2013.01);
Abstract

A printed flexible radio frequency identification (RFID) passive temperature-measuring tag based on an MXene ink is provided. At room temperature, an RFID antenna is prepared by printing the MXene ink directly on different flexible substrates through extrusion printing; and an RFID temperature-measuring chip is directly connected to the RFID antenna by using the MXene ink as a binder without an additional metallic ink material such as a conductive silver paste or a binder. The MXene ink of the present disclosure has comparable physical and chemical properties such as high electrical conductivity and mechanical properties to the traditional metallic ink. Compared with an antenna printed by the traditional metallic ink, the printed RFID antenna based on the MXene ink does not require a high-temperature post-treatment after printing, has no restriction on the selection of a flexible substrate, and does not cause heavy metal pollution.


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